Non-Silicone Thermal Conductive Gel Conductivity 5.0W

GPU-500SF is a silicone-free thermally conductive putty with a high performance thermal conductivity compound.It is a fully cured thermal management solution for electronic components.It has low viscosity for dispensing applications. The material has good adhesion to heat sinks and can be used in applications involving automated dispensing equipment or stencil screen printing.It is ideal for rework and field repair situations.Compared to thermally conductive pads, this material completely fills in the gaps, compresses well, and saves money.GPU-300SF is RoHS compliant and halogen free, providing additional assurance in applications where hazardous substances are prohibited.   Features and Benefits: Thermal conductivity 5.0 W/m-K; non-silicone; non-curing; natural adhesion & low contact resistance; good compressibility; good electrical insulation properties   Applications: heat sources for radiators/sinks; computer and peripheral heat sinks; memory modules; power conversio…

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