High Precision Wafer Grinding Wheels

The IF Series in-feed grinding wheels are excellent for processing not only silicon, but also compound semiconductors, ceramics, crystals, and a wide range of other materials. In addition, kemei offers applications and IF Series wheels to match virtually any wafer size or processing requirement. Capable of precision grinding to planarize etched wafers. Kemei produces all kinds of diamond grinding wheels, such as metal bond and resin bond grinding wheels which are used for all kinds of applications. Contact us for more information. Product Parameters: Material  :    diamond abrasive Bond :          resin bond Brand:          KEMEI Feature:       high precision grinding wheels Compatible Material :silicon wafer, silicon-based chips, crystal, …

Metal Bond Diamond Wheels Resin Bond Grinding Wheels Bench Grinding Wheel CBN Cutting Discs Knife Grinding Wheel