This resin bond diamond
grinding wheel is used for back thinning, front grinding and fine grinding of
discrete devices, integrated circuit substrate silicon wafers, sapphire
epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips. The
back grinding wheels can be used for the Japanese ,German, American, Korean and
other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH
grinding machine, etc ).
Kemei produces all types if diamond
grinding wheels, such as diamond grinding wheels, CBN grinding wheels, resin
bond grinding wheels, metal bond diamond wheels. We can produce any size and
any grits, to fully meet with your grinding applications. Contact us for more.
Product Parameters:
Material : diamond abrasive
Bond : resin bond
Brand: KEMEI…